TSMC and Apple have a long standing partnership, and I doubt TSMC is dumb enough to throw a massive amount of long term business away in exchange for short term AI bubble gains.
TSMC has even been cutting Apple special terms they don't give others:
> every time TSMC introduces a major upgrade, called an advanced process node, to its chipmaking, the defect rates of the dies stay relatively high until it can iron out the kinks. For 3 nm, the most cutting-edge node launching this year, the yield on wafers has recently been in the range of 70% to 80%, according to analysts, as well as one person with direct knowledge of the process.
That number would be a tough pill to swallow for TSMC’s customers, which typically pay for the wafer and all of the dies on it—including the bad ones. But in a break from standard practice, the Taiwanese manufacturer has only been charging Apple for dies that work—“known good dies,” in industry parlance—these people said.
I doubt TSMC has a choice. Any fab allocation Apple can pay for, Nvidia can afford twice over. With that kind of money Nvidia could swallow the cost of 40% broken dies and still turn out higher hardware margins than any 2nm iPhone ever could. Neither the iPhone Air nor Vision Pro justify Apple's push to dominate the latest nodes.
Novelty applications like "performance smartphone hardware" will have to wait on the sidelines. The datacenter needs it more than Apple or Qualcomm, and they've brought the beaucoup bucks to prove it.