To be fair, Intel is finally making the major manufacturing equipment investments needed to catch up.

They previously did stock buybacks and acquisitions of other companies that went nowhere instead of investing in the EUV manufacturing equipment TSMC used. Now they have the more advanced version of EUV in production.

> Intel has reported processing over 30,000 wafers in a single quarter using High-NA EUV exposure, achieving simplified manufacturing by reducing the required steps for a particular layer from 40 to fewer than 10,

https://www.techpowerup.com/342239/intels-advanced-packaging...