This is false. 3D VCache is enabled by TSMC's 3DFabric packaging. It also didn't really play a role in AMD passing Intel. Chiplets are also enabled by TSMC technology, CoWoS.
But AMD decided to use those technologies and Intel decided not to. AMD on TSMC N4 is beating Intel on TSMC N3 because AMD has better designs.
> 3D VCache is enabled by TSMC's 3DFabric packaging
> Chiplets are also enabled by TSMC technology, CoWoS.
Interesting, my mistake. Thank you for pointing that out!