I think the "printegrated circuits" approach is roughly the right level of abstraction.

3D Printing the PCB itself is pretty much impossible for any non-trivial application. Doing multi-layer PCBs with 0.20mm wide traces, spaced 0.20mm apart? Forget it, not happening - and requirements like those are standard for hobbyist-level chips like the RP2040 these days.

And if you're not printing your own PCB, what's left is module-level assembly and connectivity. In other words, just printing a bunch of wires.