alt Hacker NewsThey are nowhere close to beat ASML.
This isn't a moat ASML can keep for long though. There can be alternatove technologies to achieve the same goal. So far only China has that incentive. The real problem is process scaling is slowing down. How many more generations of lithography machines will ASML design? Probably not many. This means there will be no edge left in 5 or 10 years, as eventually brute force will work and China will achieve the same lithography resolution.
Till that point, they are just going all in with cheap coal + solar, so even if they use older machines and run longer exposure times, even if they achieve lower yields and toss away a lot of the dies, they are still economically competitive. At the end cheap enery solves a lot of the issues.
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> So far only China has that incentive.
The US is close to having that incentive, if the rift between the US and Europe keeps widening. The Netherlands has one lever, but damn it's a long one.
> even if they use older machines and run longer exposure times
How do longer exposure times and older machines enable 2nm process nodes?
No, they won't beat ASML but they'll be good enough and most importantly cheap. And they'll catch up eventually.
Nowhere close, but pace now seems faster than estimated, i.e. original western estimate is they won't even get EUV prototype up until 2030s.
Right now their chips are already "economically" competitive, as in SMIC is starving on 20% margins vs ASML/TSMC/NVIDIA getting gluttonous on 50-70%, at least for enterprise AI. Current scarcity pricing = litho costs borderline rounding error, 1500 Nvidia chip flips for 30000, 6000 huawei chip flips for 20000. The problem is really # of tools access and throughput. They can only bring in so many expensive ASML machines, including smuggling, which caps how much wafers they can afford to toss at low yield. They figure out domestic DUV to 2000 series and throughput is solved.
Hence IMO people sleeping on Huawei 9030 on 5nm DUV SAQP, still using ASML DUV for high overlay requirement processes, domestic DUV to fill rest. But once they figure out SAQP overlay, which will come before EUV, they're "set". For cost a 300m-400m ASML EUV, PRC can brrrt tools at BOM / cost plus margin. Think 40 domestic DUVs and associated infra for price of one ASML EUV to run 8x lines with 30% yield and still build 2x more chips normalized for compute that they can run on cheap local energy to match operating costs. Then they have export shenanigans like bundle 5nm chips with renewable energy projects and all of sudden PRC data center + energy combo deals might be globally competitive with 3/2nm. Deal with our shitter chips for now, once they deprecate we give you something better when our processes narrows gap, and you have bonus power to boot because some jurisdictions, building grid is harder than building fabs.