We’ve been able to hold the same price we had at launch because we had buffered enough component inventory before prices reached their latest highs. We will need to increase pricing to cover supplier cost increases though, as we recently did on DDR5 modules.

Note that the memory is on the board for Ryzen AI Max, not on the package (as it is for Intel’s Lunar Lake and Apple’s M-series processors) or on die (which would be SRAM). As noted in another comment, whether the memory is on the board, on a module, or on the processor package, they are all still coming from the same extremely constrained three memory die suppliers, so costs are going up for all of them.

> Question: are SoCs with on die memory be effected by this?

SoCs with on-die memory (which is, these days, exclusively SRAM, since I don't think IBM's eDRAM process for mixing DRAM with logic is still in production) will not be effected. SiPs with on-package DRAM, including Apple's A and M series SiPs and Qualcomm's Snapdragon, will be effected -- they use the same DRAM dice as everyone else.

Apple secured at least a year-worth supply of memory (not in actual chips but in prices).

The bigger the company = longer the contract.

However it will eventually catch up even to Apple.

It is not prices alone due to demand but the manufacturing redirection from something like lpddr in iphones to hbm and what have you for servers and gpu

I would think so because fab capacity is constrained, and if you make an on-die SoC with less memory, it uses fewer transistors, so you can fit more on a wafer.