alt Hacker NewsWith current AI pricing for silicon, I think the math’s gone out the window.
For Apple, they have binning flexibility, with Pro/Max/Ultra, all the way down to iPads - and that’s after the node yields have been improved via the gazillion iPhone SoC dies.
NVIDIAs flexibility came from using some of those binned dies for GeForce cards, but the VRAM situation is clearly making that less important, as they’re cutting some of those SKUs for being too vram heavy relative to MSRP.
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> For Apple, they have binning flexibility, with Pro/Max/Ultra, all the way down to iPads
The Pro and Max chips are different dies, and the Ultra currently isn't even the same generation as the Max. And the iPads have never used any of those larger dies.
> NVIDIAs flexibility came from using some of those binned dies for GeForce cards
NVIDIA's datacenter chips don't even have display outputs, and have little to no fixed-function graphics hardware (raster and raytracing units), and entirely different memory PHYs (none of NVIDIA's consumer cards have ever used HBM).
Datacenter GPU dies cannot be binned for Geforce because they lack fixed function graphics features. Raytracing acceleration in particular must be non-trivial area that you wouldn't want to spend on a datacenter die. Not to mention the data fabric is probably pretty different.