At the end of the month, laptops with Intel's latest processors will start shipping. These use Intel's 18A process for the CPU chiplet. That makes Intel the first fab to ship a process using backside power delivery. There's no third party testing yet to verify if Intel is still far behind TSMC when power, performance and die size are all considered, but Intel is definitely making progress, and their execs have been promising more for the future, such as their 14A process.
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At the end of the month, laptops with Intel's latest processors will start shipping. These use Intel's 18A process for the CPU chiplet. That makes Intel the first fab to ship a process using backside power delivery. There's no third party testing yet to verify if Intel is still far behind TSMC when power, performance and die size are all considered, but Intel is definitely making progress, and their execs have been promising more for the future, such as their 14A process.