Intel has such a strong lead here, with Foveros doing stacked chips including ram (since the amazing, under-rated Lakefield), and with really good EIMB.

AMD is pretty famous for multi-chip, but they're only recently starting to do actually advanced integrating like Sea-of-Wires between chips. So far most of their chips have had big hot PHY to send data back & forth, rather than trying to make multiple chips that really can communicate directly with each other.

Interesting days ahead. The computer is on the chip now. A smaller domain of system building, with many of the same trade-offs & design challenges that it took to build a box.