alt Hacker NewsCan someone comment on the new dual die thing they’re promoting for how they make the M5 Pro and M5 Max chips?
How is that different from the silicon interposer they were using before?
The big change is the two dies don’t have to fabbed next to each other in a single wafer, which is fantastic for costs and yields. But would this affect the interconnect speed somehow?
How would the two be wired together?
Could this mean the Ultra comes back in M6 since it would be easier to fab?
Replies
mixtureoftakes • today at 4:40 PM
Curious about that as well.
They seem to market it as a technological advancement, which it is, but rather than being excited im actually worried about hidden latencies that could come with that approach. Have you found any interesting info on that yet?
the new dual die thing they’re promoting for how they make the M5 Pro and M5 Max chips?
It's chiplets just like GB10, Strix Halo, etc. One die has the CPU and the other die has the GPU.
How is that different from the silicon [bridge] they were using before?
It's probably similar.
the two dies don’t have to fabbed next to each other
They never were; this is a widespread misunderstanding.
But would this affect the interconnect speed somehow?
Apple never documented the internal interconnect for the M4 Pro/Max and now they don't document it for the M5 Pro/Max so we don't know. It's probably better to read reviews and avoid theorycrafting and backseat driving.