The current DIMM and SODIMM modules cannot be used for much higher speeds than are available now.
This is why there are several proposals of improved forms for memory modules, which use different sockets, like LPCAMM2, which should be able to work with faster memories.
However even LPCAMM2 is unlikely to work at the speeds of soldered GDDR7.
Can't they make it easier to solder / desolder?