alt Hacker NewsThe article reads like they are talking about the traces. What about components like surface mount resistors, IC's, etc?
The examples I noticed were things like antennas, grids, a microspring. I didn't see anything resembling a full circuit.
Replies
I dont get this - you can just print with SMD paste and then reflow the whole thing at once - though you will need high temp materials to do that, but several amateurs have done it.
Afaik there are a lot more high temp UV resins you can print with.
Components are pretty easily done via pick-and-place, which was just demonstrated on video:
https://www.youtube.com/watch?v=MGZ0qpPN1uk
once one can make traces in 3D as part of a case/shell/frame/structure things get _very_ interesting --- consider that one electronics designer actually worked up a 3D CAD system:
just for making 3D printed enclosures:
>My primary use case for 3D CAD is designing 3D-printed enclosures for my electronics projects.
So, imagine what folks like that will make when they are able to 3D print a full circuit board as part of a structure, with components place/oriented in it in novel ways (heat dissipation? LEDs to indicate status?)....
They are produced by companies that specialise in producing ICs.
They can be placed manually or automated.
A coil by any other name is an inductor, and that is really cool.
I can't imagine it is better than laser processes, but still impressive. =3
I guess they consider that a solved problem: when you can drop arbitrary connections without meaningful heating of stuff outside of the connection, just glue your SMD parts wherever you consider convenient and fuse lines to its connection pads.
But practical application would likely stick to more or less conventional boards (tiny ones for sure) and use those ink lines only for where it's needed. Unless perhaps there's an application where crossing over with simple fused layer printing allows something revolutionary from going 3D? But 2D boards are really, really cheap and multiple layers are already giving ever conceivable advantage 3D could give, outside of stuff like antenna geometries.
For one-off and prototyping, an integrated fused layer + pick&place + circuit fuser machine could be super attractive of course: basically bridging the gap between breadboard and production quality. But I really doubt that this device would be anywhere near hobby workshop tinkering range...