alt Hacker NewsThere doesn't seem to be much detail anywhere else either. All I was able to gather was that the memory dies are stacked (not new) but that the vias connecting the stack are angled instead of straight up and down and this is better because ... reasons?
I think the reasoning is better thermals and signal stability. The physics of the first seem to be that there is more metal to capture and distribute heat, but the signal integrity part beats me. By having better thermals, they can increase the memory clock and, thus, bandwidth and reduce latency.