Oh, wow, I was expecting from the title that, eh, maybe they changed the process or something, and someone was being a bit fussy. But yeah, no, different part.
Across the board TI is moving to new fabs, new fab processes and 300 mm wafers. So the old tooling is going away and they're adapting legacy designs to the new processes. This changes component behavior, particularly analog stuff, like these op amps.
That's all inevitable and has happened in the semiconductor business before. When it happens, manufacturers are forced to choose; obsolete old parts that can't be indistinguishably reproduced on the new node, or and sell substantially different components under existing SKUs, so they can keep booking orders from high volume customers without disruption.
In this case, the latter is happening. In all probability their high volume customers have already accounted for the PCN because TI told them it was coming years ago, back when the new fab buildout started and the lithography machines were first ordered.
Across the board TI is moving to new fabs, new fab processes and 300 mm wafers. So the old tooling is going away and they're adapting legacy designs to the new processes. This changes component behavior, particularly analog stuff, like these op amps.
That's all inevitable and has happened in the semiconductor business before. When it happens, manufacturers are forced to choose; obsolete old parts that can't be indistinguishably reproduced on the new node, or and sell substantially different components under existing SKUs, so they can keep booking orders from high volume customers without disruption.
In this case, the latter is happening. In all probability their high volume customers have already accounted for the PCN because TI told them it was coming years ago, back when the new fab buildout started and the lithography machines were first ordered.