Not an expert but I wondered this too and did some searching. My understanding is the laser cooling isn't expected to be applicable to silicon logic anytime soon. Its applications are more for specialized contexts like cooling quantum sensors, resonators, imagers, etc.

The big barrier remains heat and this 3D stacking (aka CFET) makes heat worse by increasing density. It's possible much of the density gains offered by CFETs will remain unutilized unless other approaches to solve the fundamental heat problem are found, possibly discovering new high-conductivity MDI materials.

The future is to replace the Si base with something else. Silicon Carbide has higher thermal conductivity. Bismuth-based composites provide much higher frequency.

https://semiengineering.com/the-race-to-replace-silicon/

https://www.plantengineering.com/semiconductor-material-that...