You can start by reading up on TSMC's name for the tech (although there are many versions at TSMC and TSMC isn't the only company packaging chiplets and memory on top of a silicon interposer).

> CoWoS (Chip-on-Wafer-on-Substrate)

https://semiwiki.com/wikis/industry-wikis/cowos-chip-on-wafe...

It's a more advanced update from their older InFO tech.