Well, no, it's not.
If anything, it's closer to the bin packing problem. The cost function isn't expressed in terms of lowest cost between nodes, but instead fitting all of the traces with the lowest board layer count while still meeting stuff like EMI crosstalk guidelines. Then there'll be some traces that are very constrained (think DRAM or SERDES links) that have to be length matched, but those are pretty much invariably point to point links that already are heavily automated.
Traces being, say 20% longer than they need to be for an optimal solution doesn't really change the performance of the board in the vast majority of cases since they'll be some of the lowest resistance components of the netlist anyway, as well as the fact that the PCB is normally oversized for the number of traces needed as it fulfills structural/mechanical needs as well as the netlist needs.
And on top of that, because the optimal solution probably is NP-hard, once again, the industry doesn't look for optimal, only good enough. If layout techs in Altium were regularly solving NP-hard problems, computer science would be a different place. The only goal I see is to meet that bar without hiring layout techs.
>Traces being, say 20% longer than they need to be doesn't really change the performance of the board
Impedance matching requires you know what you are doing, and Altium will only take you so far. For the price, Altium/Protel has always been a poor deal for what you get software wise.
Even free Qspice (a more modern Analog Devices LTSpice) is a far better option:
https://www.qorvo.com/design-hub/calculators-simulation/qspi...
>the industry doesn't look for optimal, only good enough
Indeed, that is why your iPhone still weighs 3.7 kg. =3