How so? FEOL is pretty much the same, BEOL is almost the same save TSVs, the packaging tech is different and more advanced, but not exactly 1:1 comparable. Do TSVs really occupy 3x the area of DDR IO's?
3x is a reasonable figure. They are not literally that large, though.
See remark on the slide 11: https://www.servethehome.com/micron-evolving-memory-architec... That presentation is by Micron.