3D-Cache blows Intel out of the water and has absolutely nothing to do with TSMC. Same goes for the clever chiplet design.
This is false. 3D VCache is enabled by TSMC's 3DFabric packaging. It also didn't really play a role in AMD passing Intel. Chiplets are also enabled by TSMC technology, CoWoS.
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This is false. 3D VCache is enabled by TSMC's 3DFabric packaging. It also didn't really play a role in AMD passing Intel. Chiplets are also enabled by TSMC technology, CoWoS.