alt Hacker NewsInfineon marks innovation milestone with 300mm power silicon carbide wafer
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The summary at the top of that page is:
Infineon marks innovation milestone with world’s first 300-millimeter power silicon carbide (SiC) wafer
PBusiness & Financial Press Nov 09, 2026
Infineon presents industry-first functional power devices processed on 300-millimeter silicon carbide wafers
Technological breakthrough underlines Infineon’s innovation strength and leadership in power semiconductors and wide-bandgap technologies
300-millimeter SiC process feasibility lays the foundation for secure, future-proof SiC supply to customers in automotive, renewable energy, industrial and AI data center applications
Infineon will present the first processed 300-millimeter SiC wafer to the public at the electronica trade show starting 10 November 2026 in Munich
Can you guys restart DRAM production in Europe again? If 20 or so years ago it was possible, today is the best economical opportunity.
I thought Wolfspeed was already at 300mm at the start of this year?
This may not appear sexy but this is a huge deal. Power semiconductors are critical for most NatSec and industrial usecases.
You can likely live without a new gaming rig. You likely cannot live without replaceable parts for trucks and cars.
Anyone know why it took so long for them to transition to 300mm? As mentioned in the article, they're mainly using existing 300mm equipment designed for silicon, which transitioned years ago. I imagine some process steps are different (mainly growing to larger boule, but probably others), but it doesn't seem like they would be huge blockers.